The AD7896 is a fast, 12-bit ADC which operates from a single +2.7 V to 5.5 V supply and is housed in a small 8-pin mini-DIP and 8-pin SOIC. The part contains an 8 ms successive approximation A/D converter, an on-chip track/hold amplifier, an onchip clock and a high speed serial interface.
Output data from the AD7896 is provided via a high speed, serial interface port. This two-wire serial interface has a serial clock input and a serial data output with the external serial clock accessing the serial data from the part.
In addition to the traditional dc accuracy specifications such as linearity, full-scale and offset errors, the AD7896 is also specified for dynamic performance parameters including harmonic distortion and signal-to-noise ratio.
The part accepts an analog input range of 0 V to VDD and operates from a single +2.7 V to +5.5 V supply consuming only 9 mW typical. The VDD input is also used as the reference for the part so that no external reference is required.
The AD7896 features a high sampling rate mode and, for low power applications, a proprietary automatic power down mode where the part automatically goes into power down once conversion is complete and "wakes up" before the next conversion cycle.
The part is available in a small, 8-pin, 0.3'' wide, plastic or hermetic dual-in-line package (mini-DIP) and in an 8-pin, small outline IC (SOIC).
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +7 V
VDD to DGND. . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +7 V
Analog Input Voltage to AGND . . . . . . 0.3 V to VDD + 0.3 V
Digital Input Voltage to DGND . . . . . . 0.3 V to VDD + 0.3 V
Digital Output Voltage to DGND . . . . . 0.3 V to VDD + 0.3 V
Operating Temperature Range
Commercial (J Version) . . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial (A, B Versions) . . . . . . . . . . . . .40°C to +85°C
Extended (S Version) . . . . . . . . . . . . . . 55°C to +125°C
Storage Temperature Range . . . . . . . . . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW
qJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 125°C/W
qJC Thermal Impedance. . . . . . . . . . . . . . . . . . . . . . 50°C/W
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . +260°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . .. 450 mW
qJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . .160°C/W
qJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . .75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >4000 V
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure
Required Field 
